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Packaging Materials Engineer - MA
We are seeking an
experienced Microelectronics Packaging Materials
Engineer to join the team.
In this position you will interface with vendors to
evaluate materials and processes to enhance product and
process quality for new package developments and
continuous improvement of existing packages in
production. You will work closely with the design,
quality and reliability, product and marketing engineers
in a core team environment to establish the new
automotive device packaging requirements per automotive
industry standards.
Your responsibilities will include:
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Using appropriate tools,
perform complete engineering analysis and technology
assessments to ensure the selected material process
and technology will result in first pass success
during qualification and zero defects in mass
production. |
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Evaluating the new
packaging materials and process robustness in pre
qualification stage to ensure the first pass success.
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Work on assembly material
specifications, process troubleshooting, and
evaluating package qualifications to achieve zero ppm
assembly defects in mass production volume. |
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Work with assembly
subcontractors in evaluating and qualifying new die
attach, bond wire and plating materials as well as
Grade Zero green molding compounds in high volume
production. |
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Establishing strong
working relationships with internal customers
marketing, design, quality, planning, business units
and assembly sub-contractors. |
The successful candidate
will possess a minimum of a BS Degree in any of the
following disciplines: Mechanical Engineering, Chemical
Engineering, Materials Science or Theoretical and
Applied Mechanics, plus a minimum of 5 years related
experience. Experience in high volume manufacturing of
plastic molded packages with zero defects, and knowledge
of advanced electronic packaging plating and materials
to achieve Grade zero automotive IC packaging is
required.
Specific skills needed are:
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Familiarity with die
attach epoxies, mold compound and wire bond materials
for automotive and commercial semiconductor devices.
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Plating experience with
Ag, Ni/Pd/Au and Sn including Sn whisker testing and
control
Experience with wafer bumping technologies. |
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A proven track record of
using Design Of Experiments to diagnose manufacturing
problems and optimize processes. |
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SEM, C-SAM, EDX and FTIR
experience (operating and understand results)
Knowledge of CAD is very helpful. |
This position requires a
high level of commitment, self-motivation and the
ability to communicate well with multiple departments
and levels in the organization and externally with
suppliers. This includes the written and verbal skills
needed to explain complex technical issues.
Familiarity with die attach epoxies, mold compound and
wire bond materials for automotive and commercial
semiconductor devices.
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Plating experience with
Ag, Ni/Pd/Au and Sn including Sn whisker testing and
control
Experience with wafer bumping technologies. |
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A proven track record of
using Design Of Experiments to diagnose manufacturing
problems and optimize processes. |
|
SEM, C-SAM, EDX and FTIR
experience (operating and understand results)
Knowledge of CAD is very helpful. |
|
This position requires a
high level of commitment, self-motivation and the
ability to communicate well with multiple departments
and levels in the organization and externally with
suppliers. This includes the written and verbal skills
needed to explain complex technical issues. |
|
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If you meet the above requirements please send an email to
tstipe@austinprosearch.com. Please include your industry
experience and contact information, or attach your Word
resume. Your information will remain confidential.
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