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BEOL Integration Manager - NY
Job Summary:
This BEOL Integration Manager position is within the
Technology Integration group supporting the technologies
that will be manufactured and reports into the Director
of Technology Integration as part of the operations
organization. The Technology Integration group is
responsible for the transfer, implementation,
qualification and production ramp of manufacturing
technologies in support the roadmap and customers to
meet all key production indices such as Wafer Cost,
Cycle Time, Line Yield, Delivery to Commitment, Wafer
and Die Yields, Reliability, etc. This position also has
responsibility of meeting specific technology
requirements of customers' products and driving cost and
yield improvements of technologies running in
production.
This position is responsible for the process flow and
integration of all back-end-of-line (BEOL) process
modules from contact (or local interconnect) through all
Cu / low k interconnect levels including terminal metal.
Support of multiple interconnect configurations across
multiple technology nodes is needed to support customer
product requirements meeting electrical, performance,
yield, reliability, packaging and cost requirements of a
given foundry technology node.
Specific Responsibilities Include:
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Responsible for staffing
and development of the BEOL Integration team working
closely with the Director of Technology Integration.
This responsibility includes creating and executing a
staffing and training plan for the BEOL Integration
team (engineers, technicians, support staff) to
support the technology and production goals from
start-up to production ramp to sustaining development
work. |
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Work with HR to develop
and execute recruiting plans to meet the BEOL
integration team staffing requirements. Work with
training organization to develop and execute training
plans for all job levels in order to achieve job
performance and future growth requirements. |
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Insure successful set up
by the BEOL integration team of process flows for
technologies transferring and insure matching of the
resulting integrated process to electrical, physical,
reliability, yield/defectivity and cost requirements. |
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Debug and resolve all
BEOL issues of manufacturing technologies during
installation, production ramp and high volume
manufacturing working closely with process modules,
yield engineering, and customer / product engineering. |
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Define and execute with
counterparts and/or R&D technology transfer plans for
bringing technologies into manufacturing including
cross-site technology transfer activities (ex-pat
assignments, wafer exchanges, technology transfer
meetings, etc). |
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Interact with the
relevant program management office to create project
plans, deliverables, resource plans, etc to
effectively manage the execution of multiple
concurrent technology nodes running in manufacturing. |
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Engage with the R&D
organization on providing manufacturing inputs into
the definition and development of new technology nodes
with manufacturability, cost and yield expectations.
Provide continuous engagment in R&D program reviews to
guide and support R&D activities prior to technology
transfer. |
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Support the process
modules (etch, thin films, litho, CMP, etc) and
facilities teams on process chemical and equipment
requirements for start-up and for introduction of new
technology nodes into manufacturing. |
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Work with Industrial
Engineering, Lean Manufacturing, Yield and Product
Engineering to identify and resolve the production
needs of new technologies and continuously improve
manufacturing effectiveness and drive cost reduction. |
Required Qualifications:
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B.S. Degree in Electrical
Engineering, Materials Science, Solid State Physics or
other relevant engineering or physical science
discipline is required; advanced degree (M.S. or
Ph.D.) strongly preferred. |
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Minimum of 10 years of
Semiconductor fab experience with 5 years as a
manager. |
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Excellent verbal and
written communication skills. |
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Strong interpersonal
skills and ability to work effectively with different
cultures. |
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Strong organization and
leadership skills, ability to work effectively with
all levels of wafer Fab organization. |
Preferred
Qualifications:
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MS or PhD strongly
preferred |
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Experience in a foundry
environment managing multiple technology nodes and
products. |
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Experience in leading
edge technology nodes (sub-65nm node) including BEOL
requirements for derivative technologies such as RF,
analog/mixed signal, non-volatile memory, low power,
high voltage, etc. |
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Specific experience in Cu
interconnect and low k dielectric materials and
processes is strongly preferred. |
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If you meet the above requirements please send an email to
tstipe@austinprosearch.com. Please include your industry
experience and contact information, or attach your Word
resume. Your information will remain confidential.
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