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BEOL Integration Manager - NY

 

Job Summary:
This BEOL Integration Manager position is within the Technology Integration group supporting the technologies that will be manufactured and reports into the Director of Technology Integration as part of the operations organization. The Technology Integration group is responsible for the transfer, implementation, qualification and production ramp of manufacturing technologies in support the roadmap and customers to meet all key production indices such as Wafer Cost, Cycle Time, Line Yield, Delivery to Commitment, Wafer and Die Yields, Reliability, etc. This position also has responsibility of meeting specific technology requirements of customers' products and driving cost and yield improvements of technologies running in production.

This position is responsible for the process flow and integration of all back-end-of-line (BEOL) process modules from contact (or local interconnect) through all Cu / low k interconnect levels including terminal metal. Support of multiple interconnect configurations across multiple technology nodes is needed to support customer product requirements meeting electrical, performance, yield, reliability, packaging and cost requirements of a given foundry technology node.


Specific Responsibilities Include:

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Responsible for staffing and development of the BEOL Integration team working closely with the Director of Technology Integration. This responsibility includes creating and executing a staffing and training plan for the BEOL Integration team (engineers, technicians, support staff) to support the technology and production goals from start-up to production ramp to sustaining development work.

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Work with HR to develop and execute recruiting plans to meet the BEOL integration team staffing requirements. Work with training organization to develop and execute training plans for all job levels in order to achieve job performance and future growth requirements.

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Insure successful set up by the BEOL integration team of process flows for technologies transferring and insure matching of the resulting integrated process to electrical, physical, reliability, yield/defectivity and cost requirements.

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Debug and resolve all BEOL issues of manufacturing technologies during installation, production ramp and high volume manufacturing working closely with process modules, yield engineering, and customer / product engineering.

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Define and execute with counterparts and/or R&D technology transfer plans for bringing technologies into manufacturing including cross-site technology transfer activities (ex-pat assignments, wafer exchanges, technology transfer meetings, etc).

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Interact with the relevant program management office to create project plans, deliverables, resource plans, etc to effectively manage the execution of multiple concurrent technology nodes running in manufacturing.

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Engage with the R&D organization on providing manufacturing inputs into the definition and development of new technology nodes with manufacturability, cost and yield expectations. Provide continuous engagment in R&D program reviews to guide and support R&D activities prior to technology transfer.

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Support the process modules (etch, thin films, litho, CMP, etc) and facilities teams on process chemical and equipment requirements for start-up and for introduction of new technology nodes into manufacturing.

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Work with Industrial Engineering, Lean Manufacturing, Yield and Product Engineering to identify and resolve the production needs of new technologies and continuously improve manufacturing effectiveness and drive cost reduction.

Required Qualifications:

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B.S. Degree in Electrical Engineering, Materials Science, Solid State Physics or other relevant engineering or physical science discipline is required; advanced degree (M.S. or Ph.D.) strongly preferred.

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Minimum of 10 years of Semiconductor fab experience with 5 years as a manager.

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Excellent verbal and written communication skills.

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Strong interpersonal skills and ability to work effectively with different cultures.

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Strong organization and leadership skills, ability to work effectively with all levels of wafer Fab organization.

Preferred Qualifications:

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MS or PhD strongly preferred

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Experience in a foundry environment managing multiple technology nodes and products.

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Experience in leading edge technology nodes (sub-65nm node) including BEOL requirements for derivative technologies such as RF, analog/mixed signal, non-volatile memory, low power, high voltage, etc.

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Specific experience in Cu interconnect and low k dielectric materials and processes is strongly preferred.

If you meet the above requirements please send an email to tstipe@austinprosearch.com. Please include your industry experience and contact information, or attach your Word resume. Your information will remain confidential.


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