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Device Engineering Manager - NY
Job Summary:
This Device Engineering Manager position is within the
Technology Integration group supporting the technologies
that will be manufactured and reports into the Director
of Technology Integration as part of the operations
organization. The Technology Integration group is
responsible for the transfer, implementation,
qualification and production ramp of manufacturing
technologies in support of the roadmap and customers to
meet all key production indices such as Wafer Cost,
Cycle Time, Line Yield, Delivery to Commitment, Wafer
and Die Yields, Reliability, etc. This position also has
responsibility of meeting specific technology
requirements of customers' products and driving device
performance, cost and yield improvements of technologies
running in production.
This position is responsible for the set-up, targeting
and performance improvements of all transistor and
passive devices within all technologies running in
manufacturing working very closely with the FEOL process
integration, yield, product and customer engineering
teams. This role is responsible for delivering upon the
requirements of all logic, SRAM, analog, I/O, and
passive devices (resistors, fuses, diodes, etc) meeting
electrical, performance, yield, reliability and cost
targets of a given foundry technology node.
Specific Responsibilities Include:
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Responsible for staffing
and development of the Device Engineering team working
closely with the Director of Technology Integration.
This responsibility includes creating and executing a
staffing and training plan for the Device Engineering
team (engineers, technicians, support staff) to
support the technology and production goals from
start-up to production ramp to sustaining development
work. |
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Work with HR to develop
and execute recruiting plans to meet the Device
Engineering team staffing requirements. Work with
training organization to develop and execute training
plans for all job levels in order to achieve job
performance and future growth requirements. |
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Insure successful set up
by the Device Engineering and FEOL process integration
teams of process flows for technologies transferring
into and insure matching of the resulting transistors
and passive devices to electrical, physical,
reliability, yield/defectivity and cost requirements. |
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Debug and resolve all
transistor related issues of manufacturing
technologies during installation, production ramp and
high volume manufacturing working closely with process
modules, yield engineering, and customer / product
engineering. Drive transistor and passive device. |
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Define and execute with
counterparts and/or R&D technology transfer plans for
bringing technologies into manufacturing including
cross-site technology transfer activities (ex-pat
assignments, wafer exchanges, technology transfer
meetings, etc). |
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Interact with the
relevant program management office to create project
plans, deliverables, resource plans, etc to
effectively manage the execution of multiple
concurrent technology nodes running in manufacturing. |
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Engage with the R&D
organization on providing manufacturing inputs into
the definition and development of new technology nodes
with performance, cost and yield expectations. Provide
continuous engagement in R&D program reviews to guide
and support R&D activities prior to technology
transfer. |
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Interact closely with
yield, customer and product engineering to resolve
specific product interactions related to transistor
parametrics and performance. |
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Work with Industrial
Engineering, Lean Manufacturing, Yield and Product
Engineering to identify and resolve the production
needs of new technologies and continuously improve
manufacturing effectiveness and drive cost reduction. |
Required Qualifications:
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B.S. Degree in Electrical
Engineering, Solid State Physics or other relevant
engineering or discipline is required; advanced degree
(M.S. or Ph.D.) strongly preferred
- Minimum of 10 years of integration and/or transistor
engineering experience with 5 years as a manager. |
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Excellent verbal and
written communication skills |
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Strong interpersonal
skills and ability to work effectively with different
cultures |
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Strong organization and
leadership skills, ability to work effectively with
all levels of wafer Fab organization |
Preferred
Qualifications:
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MS or PhD strongly
preferred |
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Experience in a foundry
environment supporting device engineering efforts
across multiple technology nodes and products |
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Experience in leading
edge technology nodes (sub-65nm node) including
derivative technologies such as RF, analog/mixed
signal, non-volatile memory, low power, high voltage,
etc. |
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If you meet the above requirements please send an email to
tstipe@austinprosearch.com. Please include your industry
experience and contact information, or attach your Word
resume. Your information will remain confidential.
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